Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/16237 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 825 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 57 |
| 2016 | 74 |
| 2017 | 99 |
| 2018 | 83 |
| 2019 | 80 |
| 2020 | 82 |
| 2021 | 51 |
| 2022 | 47 |
| 2023 | 78 |
| 2024 | 47 |
| 2025 | 114 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
US-2024021538-A1 · Jan 18, 2024 · US
Coreless packaging substrate and method of fabricating the same
US-9484223-B2 · Nov 1, 2016 · US
Wiring board and method of manufacturing wiring board
US-9224684-B2 · Dec 29, 2015 · US
Stack packages and methods of fabricating the same
US-9214410-B2 · Dec 15, 2015 · US
Electronic components assembly
US-9204530-B2 · Dec 1, 2015 · US
Mounting structure and mounting method
US-9204551-B2 · Dec 1, 2015 · US
Bump on pad (BOP) bonding structure
US-9196573-B2 · Nov 24, 2015 · US
Semiconductor package with single sided substrate design and manufacturing methods thereof
US-9196597-B2 · Nov 24, 2015 · US
Method for assembling a chip in a flexible substrate
US-9179586-B2 · Nov 3, 2015 · US
Interconnect structures and methods of making the same
US-9173282-B2 · Oct 27, 2015 · US
Circuit module with multiple submodules
US-9171823-B2 · Oct 27, 2015 · US
System-in-package having integrated passive devices and method therefor
US-9171797-B2 · Oct 27, 2015 · US
Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
US-9165888-B2 · Oct 20, 2015 · US
Methods and apparatus for bump-on-trace chip packaging
US-9165796-B2 · Oct 20, 2015 · US
Flip-chip hybridization of microelectronic components using suspended fusible resistive connection elements
US-9165915-B2 · Oct 20, 2015 · US
Crack stopper on under-bump metallization layer
US-9159686-B2 · Oct 13, 2015 · US
Flip chip interconnection having narrow interconnection sites on the substrate
US-9159665-B2 · Oct 13, 2015 · US
Wiring substrate and manufacturing method thereof
US-9159648-B2 · Oct 13, 2015 · US
Semiconductor device
US-9159657-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/16237?
- CPC H01L2224/16237 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/16237 (Electricity)?
- Our database includes 825 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/16237 growing?
- Publication counts under this code: 47 in 2024 vs 114 in 2025 (latest complete years).