Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/05147 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 2,094 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 99 |
| 2016 | 141 |
| 2017 | 282 |
| 2018 | 235 |
| 2019 | 221 |
| 2020 | 208 |
| 2021 | 164 |
| 2022 | 177 |
| 2023 | 171 |
| 2024 | 178 |
| 2025 | 188 |
| 2026 | 30 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
Process for realizing a connecting structure
US-9224704-B2 · Dec 29, 2015 · US
Semiconductor device having a through-substrate via
US-9224714-B2 · Dec 29, 2015 · US
Semiconductor device having non-circular connectors
US-2015371963-A1 · Dec 24, 2015 · US
Integrated inductor
US-9219106-B2 · Dec 22, 2015 · US
Package on package structures and methods for forming the same
US-9219030-B2 · Dec 22, 2015 · US
Electronic device packages having bumps and methods of manufacturing the same
US-9209146-B2 · Dec 8, 2015 · US
Semiconductor package
US-9209148-B2 · Dec 8, 2015 · US
Semiconductor device and method of forming the same
US-9196505-B2 · Nov 24, 2015 · US
Semiconductor bonding structure
US-9196595-B2 · Nov 24, 2015 · US
Bonding pad for printed circuit board and semiconductor chip package using same
US-9192048-B1 · Nov 17, 2015 · US
Die edge contacts for semiconductor devices
US-9190347-B2 · Nov 17, 2015 · US
Bump structure with underbump metallization structure and integrated redistribution layer
US-9190373-B2 · Nov 17, 2015 · US
Chip packaging structures and treatment methods thereof
US-2015325544-A1 · Nov 12, 2015 · US
Integrated circuit
US-2015325537-A1 · Nov 12, 2015 · US
Bump pad structure
US-9171811-B2 · Oct 27, 2015 · US
Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
US-9165888-B2 · Oct 20, 2015 · US
Method for separating a plurality of dies and a processing device for separating a plurality of dies
US-9165895-B2 · Oct 20, 2015 · US
Crack stopper on under-bump metallization layer
US-9159686-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/05147?
- CPC H01L2224/05147 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/05147 (Electricity)?
- Our database includes 2,094 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/05147 growing?
- Publication counts under this code: 178 in 2024 vs 188 in 2025 (latest complete years).