Method of making metal substrates with structures formed therein
US-2024404922-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/4803 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 474 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 29 |
| 2016 | 38 |
| 2017 | 39 |
| 2018 | 55 |
| 2019 | 68 |
| 2020 | 46 |
| 2021 | 37 |
| 2022 | 42 |
| 2023 | 35 |
| 2024 | 39 |
| 2025 | 38 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Process for producing package for mounting a semiconductor element and mold release film
US-2016368176-A1 · Dec 22, 2016 · US
Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet
US-2016372400-A1 · Dec 22, 2016 · US
Method of mechanical separation for a double layer transfer
US-2016358805-A1 · Dec 8, 2016 · US
Method of diamond nucleation and structure formed thereof
US-2016340777-A1 · Nov 24, 2016 · US
Mechanical handling support for thin cores using photo-patternable material
US-2016315024-A1 · Oct 27, 2016 · US
Semiconductor package substrate, package system using the same and method for manufacturing thereof
US-9466543-B2 · Oct 11, 2016 · US
Semiconductor packages and related manufacturing methods
US-2016293531-A1 · Oct 6, 2016 · US
Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
US-2016293514-A1 · Oct 6, 2016 · US
Cooling system for molded modules and corresponding manufacturing methods
US-9449895-B2 · Sep 20, 2016 · US
Electronic package and fabrication method thereof
US-2016260644-A1 · Sep 8, 2016 · US
Method of manufacturing semiconductor package
US-9412707-B2 · Aug 9, 2016 · US
Enhanced modularity in heterogeneous 3D stacks
US-9390989-B2 · Jul 12, 2016 · US
Enhanced modularity in heterogeneous 3D stacks
US-9373557-B2 · Jun 21, 2016 · US
Package structure and manufacturing method thereof
US-2016163614-A1 · Jun 9, 2016 · US
Laminate substrates having radial cut metallic planes
US-2016163611-A1 · Jun 9, 2016 · US
Manufacturing method of semiconductor package and semiconductor package
US-2016163565-A1 · Jun 9, 2016 · US
Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate
US-2016163579-A1 · Jun 9, 2016 · US
Packaging Devices and Methods for Semiconductor Devices
US-2016163657-A1 · Jun 9, 2016 · US
Low cost repackaging of thinned integrated devices
US-9330943-B2 · May 3, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/4803?
- CPC H01L21/4803 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/4803 (Electricity)?
- Our database includes 474 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/4803 growing?
- Publication counts under this code: 39 in 2024 vs 38 in 2025 (latest complete years).