Multilayer ceramic electronic component
US-11205543-B2 · Dec 21, 2021 · US
obtained by injection of metal in cavities formed in a ceramic body
obtained by injection of metal in cavities formed in a ceramic body · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G4/302 |
| Official title | {obtained by injection of metal in cavities formed in a ceramic body} |
| Display label | obtained by injection of metal in cavities formed in a ceramic body |
| Total patents | 247 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 4 |
| 2017 | 6 |
| 2018 | 2 |
| 2019 | 5 |
| 2020 | 19 |
| 2021 | 59 |
| 2022 | 59 |
| 2023 | 59 |
| 2024 | 18 |
| 2025 | 8 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multi-layered ceramic capacitor
US-2021383971-A1 · Dec 9, 2021 · US
Multi-layered ceramic electronic component and manufacturing method thereof
US-11158458-B2 · Oct 26, 2021 · US
Capacitor component
US-11145462-B2 · Oct 12, 2021 · US
Multilayer ceramic capacitor
US-2021313114-A1 · Oct 7, 2021 · US
Electronic component and board having the same mounted thereon
US-11133132-B2 · Sep 28, 2021 · US
Capacitor component
US-2021183575-A1 · Jun 17, 2021 · US
Multilayer ceramic capacitor
US-2021057159-A1 · Feb 25, 2021 · US
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
US-2021057156-A1 · Feb 25, 2021 · US
Multilayer capacitor and board having the same mounted thereon
US-2021050154-A1 · Feb 18, 2021 · US
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
US-2021027944-A1 · Jan 28, 2021 · US
Multilayer ceramic electronic component
US-2021020372-A1 · Jan 21, 2021 · US
Multilayer ceramic electronic component
US-2021020367-A1 · Jan 21, 2021 · US
Multi-layered ceramic capacitor
US-2021020374-A1 · Jan 21, 2021 · US
Multilayer ceramic electronic component
US-2021020373-A1 · Jan 21, 2021 · US
Multilayer electronic component and board having the same mounted thereon
US-2021020366-A1 · Jan 21, 2021 · US
Capacitor component
US-2021005383-A1 · Jan 7, 2021 · US
Multilayer ceramic capacitor
US-2021005392-A1 · Jan 7, 2021 · US
Dielectric composition and multilayered electronic component comprising the same
US-2020411240-A1 · Dec 31, 2020 · US
Multi-layered ceramic electronic component
US-2020411245-A1 · Dec 31, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01G4/302?
- CPC H01G4/302 is the Cooperative Patent Classification code for “obtained by injection of metal in cavities formed in a ceramic body.”
- How many patents are filed under CPC H01G4/302 (obtained by injection of metal in cavities formed in a ceramic body)?
- Our database includes 247 publications tagged with this CPC code.
- Is patent activity under CPC H01G4/302 growing?
- Publication counts under this code: 18 in 2024 vs 8 in 2025 (latest complete years).