Joining insulating bodies together, e.g. by bonding

Joining insulating bodies together, e.g. by bonding · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01B17/66
Official titleJoining insulating bodies together, e.g. by bonding
Display labelJoining insulating bodies together, e.g. by bonding
Total patents44

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20152
20161
20172
20181
20195
20205
20219
20229
20234
20243
20253

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01B17/66?
CPC H01B17/66 is the Cooperative Patent Classification code for “Joining insulating bodies together, e.g. by bonding.”
How many patents are filed under CPC H01B17/66 (Joining insulating bodies together, e.g. by bonding)?
Our database includes 44 publications tagged with this CPC code.
Is patent activity under CPC H01B17/66 growing?
Publication counts under this code: 3 in 2024 vs 3 in 2025 (latest complete years).