Strain relief mechanism for a mechanical or electrical device
US-12531171-B2 · Jan 20, 2026 · US
with strain relief arrangements · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01B17/586 |
| Official title | {with strain relief arrangements} |
| Display label | with strain relief arrangements |
| Total patents | 17 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 3 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 3 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12531171-B2 · Jan 20, 2026 · US
US-2025385026-A1 · Dec 18, 2025 · US
US-2025149208-A1 · May 8, 2025 · US
US-12224085-B2 · Feb 11, 2025 · US
US-2024161947-A1 · May 16, 2024 · US
US-11923109-B2 · Mar 5, 2024 · US
US-11791069-B2 · Oct 17, 2023 · US
US-11651876-B2 · May 16, 2023 · US
US-11538609-B2 · Dec 27, 2022 · US
US-2022336124-A1 · Oct 20, 2022 · US
US-2022093293-A1 · Mar 24, 2022 · US
US-2021257133-A1 · Aug 19, 2021 · US
US-2021257134-A1 · Aug 19, 2021 · US
US-10777339-B2 · Sep 15, 2020 · US
US-2019392966-A1 · Dec 26, 2019 · US
US-10515746-B2 · Dec 24, 2019 · US
US-2019244731-A1 · Aug 8, 2019 · US