Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
applied to semiconductors, e.g. Silicon
applied to semiconductors, e.g. Silicon · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01N2021/3568 |
| Official title | {applied to semiconductors, e.g. Silicon} |
| Display label | applied to semiconductors, e.g. Silicon |
| Total patents | 103 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 8 |
| 2017 | 10 |
| 2018 | 12 |
| 2019 | 8 |
| 2020 | 5 |
| 2021 | 9 |
| 2022 | 11 |
| 2023 | 10 |
| 2024 | 13 |
| 2025 | 9 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Detecting apparatus
US-2022268700-A1 · Aug 25, 2022 · US
Measurement of properties of patterned photoresist
US-2022236181-A1 · Jul 28, 2022 · US
Hybrid probe, physical property analysis apparatus including the same, and method of measuring semiconductor device using the apparatus
US-2022011225-A1 · Jan 13, 2022 · US
Film forming method and film forming apparatus
US-2021398863-A1 · Dec 23, 2021 · US
Apparatus and method for biomolecular analysis
US-11137343-B2 · Oct 5, 2021 · US
Method and device for measuring carbon concentration in silicon single crystal
US-11112354-B2 · Sep 7, 2021 · US
Method for manufacturing nitride semiconductor laminate, nitride semiconductor laminate, method for inspecting film quality, and method for inspecting semiconductor growing device
US-2021215621-A1 · Jul 15, 2021 · US
Calibration method and terminal equipment of terahertz frequency band on-wafer s parameter
US-2021181102-A1 · Jun 17, 2021 · US
Apparatus and method for biomolecular analysis
US-2021172863-A1 · Jun 10, 2021 · US
System and method to calibrate a plurality of wafer inspection system (wis) modules
US-2021131977-A1 · May 6, 2021 · US
Detecting the cleanness of wafer after post-CMP cleaning
US-10957609-B2 · Mar 23, 2021 · US
Method and device for measuring carbon concentration in silicon single crystal
US-2021055213-A1 · Feb 25, 2021 · US
In-Situ Metrology And Process Control
US-2020335369-A1 · Oct 22, 2020 · US
Semiconductor metrology based on hyperspectral imaging
US-10801953-B2 · Oct 13, 2020 · US
Method for manufacturing resistivity standard sample and method for measuring resistivity of epitaxial wafer
US-10720366-B2 · Jul 21, 2020 · US
Semiconductor Metrology Based On Hyperspectral Imaging
US-2020225151-A1 · Jul 16, 2020 · US
Optical filter including a high refractive index material
US-2020096675-A1 · Mar 26, 2020 · US
Reflective detection method and reflectance detection apparatus
US-10471536-B2 · Nov 12, 2019 · US
Method for manufacturing resistivity standard sample and method for measuring resistivity of epitaxial wafer
US-2019326184-A1 · Oct 24, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC G01N2021/3568?
- CPC G01N2021/3568 is the Cooperative Patent Classification code for “applied to semiconductors, e.g. Silicon.”
- How many patents are filed under CPC G01N2021/3568 (applied to semiconductors, e.g. Silicon)?
- Our database includes 103 publications tagged with this CPC code.
- Is patent activity under CPC G01N2021/3568 growing?
- Publication counts under this code: 13 in 2024 vs 9 in 2025 (latest complete years).