Vapor phase thermal etch solutions for metal oxo photoresists
US-12068170-B2 · Aug 20, 2024 · US
by evaporation
by evaporation · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F4/02 |
| Official title | by evaporation |
| Display label | by evaporation |
| Total patents | 68 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 3 |
| 2017 | 1 |
| 2018 | 3 |
| 2019 | 10 |
| 2020 | 11 |
| 2021 | 3 |
| 2022 | 12 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Vapor phase thermal etch solutions for metal oxo photoresists
US-12033866-B2 · Jul 9, 2024 · US
Thermal atomic layer etching processes
US-2023374671-A1 · Nov 23, 2023 · US
Method for forming groove on metal strip surface and method for manufacturing grain-oriented electrical steel sheet
US-2023366101-A1 · Nov 16, 2023 · US
Selective removal of ruthenium-containing materials
US-11798813-B2 · Oct 24, 2023 · US
Vapor phase thermal etch solutions for metal oxo photoresists
US-2023290646-A1 · Sep 14, 2023 · US
Thermal atomic layer etching processes
US-11739428-B2 · Aug 29, 2023 · US
Thermal atomic layer etching processes
US-11739427-B2 · Aug 29, 2023 · US
Decorative automotive component having multiple electrical current pathways and different surface finishes
US-2023242049-A1 · Aug 3, 2023 · US
Vapor phase thermal etch solutions for metal oxo photoresists
US-2023215736-A1 · Jul 6, 2023 · US
Vapor phase thermal etch solutions for metal oxo photoresists
US-11621172-B2 · Apr 4, 2023 · US
Etching Of Alkali Metal Compounds
US-2022396732-A1 · Dec 15, 2022 · US
Plasma etching method and plasma processing apparatus
US-11515167-B2 · Nov 29, 2022 · US
Metal contamination prevention method and apparatus, and substrate processing method using the same and apparatus therefor
US-11486043-B2 · Nov 1, 2022 · US
Selective removal of ruthenium-containing materials
US-2022344172-A1 · Oct 27, 2022 · US
Preparation of 7xxx aluminum alloys for adhesive bonding
US-2022251710-A1 · Aug 11, 2022 · US
Preparation of 7XXX aluminum alloys for adhesive bonding
US-11346004-B2 · May 31, 2022 · US
Dry etching method and β-diketone-filled container
US-11335573-B2 · May 17, 2022 · US
Thermal atomic layer etching processes
US-2022119961-A1 · Apr 21, 2022 · US
Thermal atomic layer etching processes
US-2022119962-A1 · Apr 21, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F4/02?
- CPC C23F4/02 is the Cooperative Patent Classification code for “by evaporation.”
- How many patents are filed under CPC C23F4/02 (by evaporation)?
- Our database includes 68 publications tagged with this CPC code.
- Is patent activity under CPC C23F4/02 growing?
- Publication counts under this code: 6 in 2024 vs 4 in 2025 (latest complete years).