Glassy adhesive
US-11884848-B2 · Jan 30, 2024 · US
This page is not indexed by search engines while we improve data quality.
in which all the silicon atoms are connected by linkages other than oxygen atoms
in which all the silicon atoms are connected by linkages other than oxygen atoms · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J183/16 |
| Official title | in which all the silicon atoms are connected by linkages other than oxygen atoms |
| Display label | in which all the silicon atoms are connected by linkages other than oxygen atoms |
| Total patents | 23 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 3 |
| 2017 | 2 |
| 2018 | 6 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 2 |
| 2022 | 2 |
| 2023 | 1 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Adhesive composition, covering substrate, and cured product
US-11760903-B2 · Sep 19, 2023 · US
Glassy adhesive
US-2022348805-A1 · Nov 3, 2022 · US
Methods and systems using molecular glue for covalent bonding of solid substrates
US-11370941-B2 · Jun 28, 2022 · US
Resin composition, resin film, semiconductor laminate, method for producing semiconductor laminate and method for producing semiconductor device
US-11161932-B2 · Nov 2, 2021 · US
Adhesive composition, covering substrate, and cured product
US-2021332265-A1 · Oct 28, 2021 · US
Resin composition, resin film, semiconductor laminate, method for producing semiconductor laminate and method for producing semiconductor device
US-2020231743-A1 · Jul 23, 2020 · US
Methods and systems using molecular glue for covalent bonding of solid substrates
US-2020123416-A1 · Apr 23, 2020 · US
Wet friction material with chemically-attached friction modifier
US-2019145478-A1 · May 16, 2019 · US
Silane modified formamides
US-10125155-B2 · Nov 13, 2018 · US
Two-component hot-melt adhesive
US-10099464-B2 · Oct 16, 2018 · US
Conformable reversible adhesives with shape memory assisted delamination
US-10081746-B2 · Sep 25, 2018 · US
Silane-modified formamides
US-10040808-B2 · Aug 7, 2018 · US
Conformable reversible adhesives with shape memory assisted delamination
US-2018179425-A1 · Jun 28, 2018 · US
Cross-linkable masses based on organyl-oxysilane-terminated polymers
US-9920229-B2 · Mar 20, 2018 · US
Silyl terminated prepolymers, method for making them and adhesive compositions made therefrom
US-9765247-B2 · Sep 19, 2017 · US
Cross-linkable masses based on organyl-oxysilane-terminated polymers
US-2017260336-A1 · Sep 14, 2017 · US
Silane-modified formamides
US-2016340372-A1 · Nov 24, 2016 · US
Silane modified formamides
US-2016340371-A1 · Nov 24, 2016 · US
Cross-linkable masses based on organyl-oxysilane-terminated polymers
US-2016160103-A1 · Jun 9, 2016 · US