Active ester compound

Patent metadata

Field	Value
Publication number	US-11299448-B2
Application number	US-201816610582-A
Country	US
Kind code	B2
Filing date	Apr 10, 2018
Priority date	May 12, 2017
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

First claim

The invention claimed is:

1. An active ester compound comprising:
a fluorinated hydrocarbon structural moiety (F) and a plurality of aromatic ester structural moieties (E) in a structure of a molecule; and
an aryloxycarbonyl structure (P) or an arylcarbonyloxy structure (A) at an end of the molecule,
wherein the active ester compound is an esterification product of a compound (a1), a compound (a2), and a compound (a3), and at least one of the compound (a1), the compound (a2), and the compound (a3) contains the fluorinated hydrocarbon structural moiety (F) in a structure of a molecule, the compound (a1) being an aromatic monohydroxy compound, the compound (a2) being an aromatic polycarboxylic acid or an acid halide thereof (a2), the compound (a3) being a compound containing at least two phenolic hydroxyl groups in a structure of a molecule; and
the ratio between the number of moles of the hydroxyl groups present in the aromatic monohydroxy compound (a1) and the number of moles of the hydroxyl groups present in the compound containing two or more phenolic hydroxyl groups in the structure of the molecule (a3) is 10:90 to 75:25.

2. The active ester compound according to claim 1 , wherein the fluorinated hydrocarbon structural moiety (F) is a perfluoroalkyl group having 1 to 6 carbon atoms.

3. A curable composition comprising the active ester compound according to claim 1 and a curing agent.

4. The active ester compound according to claim 1 , wherein the compound (a1) is a substituted or unsubstituted naphthol compound.

5. The curable composition according to claim 3 , further comprising a poly(fluoroalkylene) resin.

6. A cured product of the curable composition according to claim 5 .

7. A semiconductor encapsulating material comprising the curable composition according to claim 5 .

8. A printed wiring board comprising a product of the curable composition according to claim 5 .

9. A build-up film comprising a product of the curable composition according to claim 5 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Okamoto Tatsuya
• Satou Yutaka

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/47 Primary

  comprising organic materials, e.g. plastics or resins · CPC title

• H05K2201/029

  Woven fibrous reinforcement or textile · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/40

  characterised by the curing agents used · CPC title