Liquid resin composition, cured product, wiring structure, and package using wiring structure

Patent metadata

Field	Value
Publication number	US-9624369-B2
Application number	US-201515120768-A
Country	US
Kind code	B2
Filing date	Mar 24, 2015
Priority date	Mar 25, 2014
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A liquid resin composition includes a liquid epoxy resin, a liquid curing agent, a curing accelerator and a ceramic filler. The liquid epoxy resin contains a first epoxy resin having a polyalkylene glycol framework. The liquid curing agent has a plurality of phenolic hydroxy groups per molecule. A content of the first epoxy resin in the liquid epoxy resin is in a range from 30% to 70% by mass, inclusive. The ceramic filler has an average particle diameter of 50 μm or less, and a content of the ceramic filler in the liquid resin composition is in a range from 50% to 90% by mass, inclusive. The liquid resin composition has a viscosity of 100 Pa·s or less at 25° C.

First claim

The invention claimed is:

1. A liquid resin composition comprising:
a liquid epoxy resin containing a first epoxy resin having a polyalkylene glycol framework and a second epoxy resin that is a bisphenol-type epoxy resin;
a liquid curing agent having a plurality of phenolic hydroxy groups per molecule, and a viscosity of 1000 m Pa·s or less;
a curing accelerator; and
a ceramic filler,
wherein the first epoxy resin is contained in the liquid epoxy resin at a content in a range from 30% to 70% by mass, inclusive,
the ceramic filler has an average particle diameter of 50 μm or less and is contained in the liquid resin composition at a content in a range from 50% to 90% by mass, inclusive,
the liquid resin composition has a viscosity of 100 Pa·s or less at 25° C., and is free from both of an acid anhydride and an aromatic amine, and
a cured product of the liquid resin composition has a coefficient of thermal expansion of 7 ppm/K or greater and less than 15 ppm/K.

2. The liquid resin composition according to claim 1 , further comprising a viscosity modifier that is at least one of an epoxy-type diluent and an organic solvent.

3. The liquid resin composition according to claim 2 , wherein the viscosity modifier is contained in the liquid resin composition at a content of more than 0% by mass and at most 10% by mass.

4. The liquid resin composition according to claim 1 , wherein the first epoxy resin has a molecular weight in a range from 500 to 1,000, inclusive.

5. The liquid resin composition according to claim 1 , wherein the curing accelerator contains an imidazole compound.

6. The liquid resin composition according to claim 1 further comprising at least one of urethane resin and silicone resin at a content in a range from 0.5% to 40% by mass, inclusive.

7. A cured product of the liquid resin composition according to claim 1 , the cured product having a glass transition temperature in a range from 50° C. to 120° C., inclusive, and an elastic modulus of 20 GPa or less at 25° C.

8. The cured product according to claim 7 , wherein the cured product has a Shore D hardness of 40 or more at 25° C.

9. A cured product of the liquid resin composition according to claim 1 , the cured product having a glass transition temperature in a range from 50° C. to 120° C., inclusive, and a Shore D hardness of 40 or more at 25° C.

10. A wiring structure comprising:
a cured product of the liquid resin composition according to claim 1 ; and
a metallic wiring that partially adheres to the cured product or is partially embedded in the cured product,
wherein the cured product has a glass transition temperature in a range from 50° C. to 120° C., inclusive, and an elastic modulus of 20 GPa or less at 25° C., and
the wiring structure is a coreless interposer having a thickness less than 0.2 mm.

11. A package comprising:
a wiring structure which is a coreless interposer having a thickness less than 0.2 mm, comprising:
a cured product of the liquid resin composition according to claim 1 ; and
a metallic wiring that partially adheres to the cured product or is partially embedded in the cured product; and

a semiconductor mounted to the wiring structure,
wherein the cured product has a glass transition temperature in a range from 50° C. to 120° C., inclusive, and an elastic modulus of 20 GPa or less at 25° C.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Hasegawa Takashi
• Konishi Takanori

Classifications

• H10W70/69

  Insulating materials thereof · CPC title

• C08K3/36

  Silica · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title