Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-12448490-B2 · Oct 21, 2025 · US
Compounds containing one epoxy group
Compounds containing one epoxy group · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/145 |
| Official title | {Compounds containing one epoxy group} |
| Display label | Compounds containing one epoxy group |
| Total patents | 42 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 2 |
| 2018 | 1 |
| 2019 | 5 |
| 2020 | 8 |
| 2021 | 7 |
| 2022 | 1 |
| 2023 | 4 |
| 2024 | 8 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate
US-2025223396-A1 · Jul 10, 2025 · US
Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate
US-2025179237-A1 · Jun 5, 2025 · US
Waterborne epoxy curing agent
US-2025066535-A1 · Feb 27, 2025 · US
Waterborne epoxy curing agent
US-12173113-B2 · Dec 24, 2024 · US
Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor device
US-2024368374-A1 · Nov 7, 2024 · US
Hardener for epoxy resins
US-2024247096-A1 · Jul 25, 2024 · US
Hydroxyl-functional thioether compounds and their use in curable compositions
US-2024209140-A1 · Jun 27, 2024 · US
Process of manufacturing surfactants and lubricants
US-11970574-B2 · Apr 30, 2024 · US
Process of manufacturing polyols
US-11958936-B2 · Apr 16, 2024 · US
Novel compound, and curable resin composition containing said compound
US-2024084065-A1 · Mar 14, 2024 · US
Process of manufacturing polyols
US-11912822-B2 · Feb 27, 2024 · US
Coating composition
US-11840643-B2 · Dec 12, 2023 · US
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-2023295388-A1 · Sep 21, 2023 · US
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-11702520-B2 · Jul 18, 2023 · US
Encapsulating or filling composition for electronic devices and electronic apparatus
US-11667786-B2 · Jun 6, 2023 · US
Waterborne epoxy curing agent
US-2022298296-A1 · Sep 22, 2022 · US
Epoxy resin composition and transformer comprising the same
US-11186675-B2 · Nov 30, 2021 · US
Encapsulating or filling composition for electronic devices and electronic apparatus
US-2021292546-A1 · Sep 23, 2021 · US
Coating composition
US-2021155807-A1 · May 27, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/145?
- CPC C08G59/145 is the Cooperative Patent Classification code for “Compounds containing one epoxy group.”
- How many patents are filed under CPC C08G59/145 (Compounds containing one epoxy group)?
- Our database includes 42 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/145 growing?
- Publication counts under this code: 8 in 2024 vs 4 in 2025 (latest complete years).