Method for producing mechanically robust linked particle networks
US-10138317-B2 · Nov 27, 2018 · US
Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/00 |
| Official title | Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups |
| Display label | Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups |
| Total patents | 131 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 16 |
| 2017 | 17 |
| 2018 | 9 |
| 2019 | 21 |
| 2020 | 8 |
| 2021 | 10 |
| 2022 | 5 |
| 2023 | 17 |
| 2024 | 5 |
| 2025 | 4 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Use of a silylated aromatic polyphenol derivative for the production of a phenol-aldehyde resin for reinforcement of a rubber composition
US-2018273670-A1 · Sep 27, 2018 · US
Solvent-free varnish composition, insulated coil, process for producing same, rotating machine, and closed electric compressor
US-2018258313-A1 · Sep 13, 2018 · US
Resin composition, resin sheet, resin cured product, and resin substrate
US-2018112029-A1 · Apr 26, 2018 · US
Uv curable coating compositions for organic ophthalmic lenses
US-2018113239-A1 · Apr 26, 2018 · US
Liquid level detector and fuel pump module including liquid level detector
US-9945713-B2 · Apr 17, 2018 · US
Surface treatment solutions for gold and gold alloys
US-9914838-B2 · Mar 13, 2018 · US
Compound having polymerizable group, liquid crystal composition and liquid crystal display device
US-2018023001-A1 · Jan 25, 2018 · US
Resin composition, coating material, electronic component, molded transformer, motor coil and cable
US-2018009955-A1 · Jan 11, 2018 · US
Urethane/urea-containing bis(alkenyl) ethers, prepolymers prepared using urethane/urea-containing bis(alkenyl) ethers, and uses thereof
US-2017369737-A1 · Dec 28, 2017 · US
Method for preparing polyaromatic oxide and polyaromatic oxide prepared thereby
US-9845275-B2 · Dec 19, 2017 · US
Method for manufacturing semiconductor substrate
US-9831086-B2 · Nov 28, 2017 · US
Composition for heat-dissipation members, heat-dissipation member, electronic device, and heat-dissipation-member production method
US-2017306207-A1 · Oct 26, 2017 · US
Method for manufacturing semiconductor substrate
US-2017287714-A1 · Oct 5, 2017 · US
Mechanically robust linked particle networks
US-2017260313-A1 · Sep 14, 2017 · US
2-(2,3-epoxypropyl)phenol composition and method of making
US-2017260152-A1 · Sep 14, 2017 · US
Amino sulfonic acid based polymers for copper electroplating
US-9725816-B2 · Aug 8, 2017 · US
Mechanically robust linked particle networks
US-9718914-B2 · Aug 1, 2017 · US
Thermosetting resin composition and molded body thereof
US-2017130006-A1 · May 11, 2017 · US
Curable composition, cured product, and organic electroluminescence element using same
US-9614172-B2 · Apr 4, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/00?
- CPC C08G59/00 is the Cooperative Patent Classification code for “Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups.”
- How many patents are filed under CPC C08G59/00 (Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups)?
- Our database includes 131 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/00 growing?
- Publication counts under this code: 5 in 2024 vs 4 in 2025 (latest complete years).