Ion conductive polymer and separator including the same
US-2026001981-A1 · Jan 1, 2026 · US
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Chemically modified polycondensates
Chemically modified polycondensates · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G16/04 |
| Official title | Chemically modified polycondensates |
| Display label | Chemically modified polycondensates |
| Total patents | 13 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 2 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 1 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for improving hardness of baked product
US-2025130497-A1 · Apr 24, 2025 · US
Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board
US-2021229407-A1 · Jul 29, 2021 · US
Low-temperature curable compositions
US-10563040-B2 · Feb 18, 2020 · US
Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same
US-10407598-B2 · Sep 10, 2019 · US
Diazo-resin, photoresist composition and method of preparing same
US-10303053-B2 · May 28, 2019 · US
Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same
US-2019048236-A1 · Feb 14, 2019 · US
Low-temperature curable compositions
US-2018355145-A1 · Dec 13, 2018 · US
Alkoxylated resol-type phenol resin manufacturing method, alkoxylated resol-type phenol resin, resin composition, and coating
US-2018105632-A1 · Apr 19, 2018 · US
Alkoxylated resol-type phenol resin manufacturing method, alkoxylated resol-type phenol resin, resin composition, and coating
US-2017029550-A1 · Feb 2, 2017 · US
Diazo-resin, photoresist composition and method of preparing same
US-2016334704-A1 · Nov 17, 2016 · US
Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film
US-9217053-B2 · Dec 22, 2015 · US
Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film
US-2015118499-A1 · Apr 30, 2015 · US