Resist compound, method for forming pattern using same, and method for manufacturing semiconductor device using same
US-12560865-B2 · Feb 24, 2026 · US
containing a metal · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F230/04 |
| Official title | containing a metal |
| Display label | containing a metal |
| Total patents | 49 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 3 |
| 2017 | 3 |
| 2018 | 5 |
| 2019 | 2 |
| 2020 | 9 |
| 2021 | 5 |
| 2022 | 5 |
| 2023 | 6 |
| 2024 | 7 |
| 2025 | 1 |
| 2026 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12560865-B2 · Feb 24, 2026 · US
US-2026003286-A1 · Jan 1, 2026 · US
US-2025199404-A1 · Jun 19, 2025 · US
US-2024376513-A1 · Nov 14, 2024 · US
US-2024352184-A1 · Oct 24, 2024 · US
US-12098223-B2 · Sep 24, 2024 · US
US-2024294685-A1 · Sep 5, 2024 · US
US-11976209-B2 · May 7, 2024 · US
US-11932713-B2 · Mar 19, 2024 · US
US-2024045332-A1 · Feb 8, 2024 · US
US-11762127-B2 · Sep 19, 2023 · US
US-2023260669-A1 · Aug 17, 2023 · US
US-11708493-B2 · Jul 25, 2023 · US
US-11643497-B2 · May 9, 2023 · US
US-11555132-B2 · Jan 17, 2023 · US
US-11557766-B2 · Jan 17, 2023 · US
US-2022404700-A1 · Dec 22, 2022 · US
US-11512158-B2 · Nov 29, 2022 · US
US-2022325008-A1 · Oct 13, 2022 · US
US-2022233583-A1 · Jul 28, 2022 · US
Answers are generated from the same data shown on this page.