Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device
US-12590173-B2 · Mar 31, 2026 · US
by a bond to sulfur · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F128/02 |
| Official title | by a bond to sulfur |
| Display label | by a bond to sulfur |
| Total patents | 29 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 4 |
| 2017 | 5 |
| 2018 | 4 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 3 |
| 2022 | 1 |
| 2023 | 1 |
| 2024 | 2 |
| 2025 | 1 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12590173-B2 · Mar 31, 2026 · US
US-2025382406-A1 · Dec 18, 2025 · US
US-2024269691-A1 · Aug 15, 2024 · US
US-11944982-B2 · Apr 2, 2024 · US
US-2023104730-A1 · Apr 6, 2023 · US
US-11345764-B2 · May 31, 2022 · US
US-11155674-B2 · Oct 26, 2021 · US
US-2021269572-A1 · Sep 2, 2021 · US
US-10975025-B2 · Apr 13, 2021 · US
US-2020384480-A1 · Dec 10, 2020 · US
US-2020339711-A1 · Oct 29, 2020 · US
US-2019119410-A1 · Apr 25, 2019 · US
US-10125202-B2 · Nov 13, 2018 · US
US-2018319911-A1 · Nov 8, 2018 · US
US-2018208712-A1 · Jul 26, 2018 · US
US-10023668-B2 · Jul 17, 2018 · US
US-9783624-B2 · Oct 10, 2017 · US
US-9777093-B2 · Oct 3, 2017 · US
US-9663593-B2 · May 30, 2017 · US
US-2017058059-A1 · Mar 2, 2017 · US
Answers are generated from the same data shown on this page.