Method for improving the wetting of a surface of a solid substrate by a liquid metal
US-11525178-B2 · Dec 13, 2022 · US
This page is not indexed by search engines while we improve data quality.
Tin
Tin · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B41/5161 |
| Official title | {Tin} |
| Display label | Tin |
| Total patents | 8 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2019 | 1 |
| 2020 | 1 |
| 2021 | 1 |
| 2022 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flash-sintering method for forming interface layer
US-11254615-B2 · Feb 22, 2022 · US
Method of metallizing ferrite ceramics and component comprising a metallized ferrite ceramic
US-11236024-B2 · Feb 1, 2022 · US
Method for improving the wetting of a surface of a solid substrate by a liquid metal
US-2021087666-A1 · Mar 25, 2021 · US
Structure including a thin-film layer and flash-sintering method of forming same
US-2020087211-A1 · Mar 19, 2020 · US
Compliant layer for ceramic components and methods of forming the same
US-10323326-B2 · Jun 18, 2019 · US
Compliant layer for ceramic components and methods of forming the same
US-9527777-B2 · Dec 27, 2016 · US
Insulation sheet made from silicon nitride, and semiconductor module structure using the same
US-2015061107-A1 · Mar 5, 2015 · US