Flash-sintering method for forming interface layer

US11254615B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11254615-B2
Application numberUS-201816136063-A
CountryUS
Kind codeB2
Filing dateSep 19, 2018
Priority dateSep 19, 2018
Publication dateFeb 22, 2022
Grant dateFeb 22, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods of forming structures including a substrate (e.g., ceramic) and an interface layer comprising a metal are disclosed. Structures and electrochemical cells and batteries are also disclosed. Exemplary methods include flash sintering of metal and ceramic materials. Various structures may be suitable for use as solid electrolytes in solid-state electrochemical cells, as well as for many other applications.

First claim

Opening claim text (preview).

We claim: 1. A method of forming a structure comprising a metal layer, the method comprising the steps of: providing a ceramic material; depositing a layer of metal on a top surface of the ceramic material to form a coated ceramic material; and exposing the coated ceramic material to a flash sintering process to reduce a contact angle between metal of the layer of metal on the top surface of the ceramic material to thereby cause the metal to spread on the ceramic material between electrodes used during the flash sintering and form the structure comprising the metal layer on the top surface, wherein the flash sintering process comprises applying a voltage across the ceramic material to form an electric field, and wherein a thickness of the layer of metal is about one monolayer to about 5 micrometers. 2. The method of claim 1 , wherein the ceramic material comprises lithium. 3. The method of claim 1 , wherein the ceramic material comprises lithium lanthanum zirconium oxide. 4. The method of claim 1 , wherein the ceramic material comprises Li 7 La 3 Zr 2 O 12 . 5. The method of claim 1 , wherein the metal comprises one or more of silver and tin. 6. The method of claim 1 , wherein the metal layer is continuous. 7. The method of claim 1 , wherein the step of depositing a layer of metal comprises application of metal beads or sputtering. 8. The method of claim 1 , wherein the electric field applied during the step of exposing is between about 10 V/cm and about 1000 V/cm. 9. The method of claim 1 , further comprising a step of supplying controlled current. 10. The method of claim 1 , wherein the flash sintering process includes increasing a temperature during the step of exposing at a rate of between about 1° C./minute and about 100° C./minute. 11. The method of claim 1 , wherein the flash sintering occurs at a temperature of about 300° C. and about 1000° C. 12. The method of claim 1 , further comprising a step of forming an electrochemical cell using the metal layer. 13. The method of claim 1 , further comprising a step of forming a battery using the metal layer.

Assignees

Inventors

Classifications

  • Ag or Au · CPC title

  • Applying a current during sintering, e.g. plasma sintering [SPS], electrical resistance heating or pulse electric current sintering [PECS] · CPC title

  • in electrochemical cells or batteries, e.g. fuel cells · CPC title

  • Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries · CPC title

  • Density · CPC title

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What does patent US11254615B2 cover?
Methods of forming structures including a substrate (e.g., ceramic) and an interface layer comprising a metal are disclosed. Structures and electrochemical cells and batteries are also disclosed. Exemplary methods include flash sintering of metal and ceramic materials. Various structures may be suitable for use as solid electrolytes in solid-state electrochemical cells, as well as for many othe…
Who is the assignee on this patent?
Univ Colorado Regents
What technology area does this patent fall under?
Primary CPC classification C04B41/88. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).