Crucibles and compositions and processes for making same
US-12545623-B2 · Feb 10, 2026 · US
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based on beryllium oxide
based on beryllium oxide · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B35/08 |
| Official title | based on beryllium oxide |
| Display label | based on beryllium oxide |
| Total patents | 16 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2018 | 1 |
| 2019 | 2 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 5 |
| 2023 | 1 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Doped BeO compounds for optically stimulated luminescence (OSL) and thermoluminescence (TL) radiation dosimetry
US-12247151-B2 · Mar 11, 2025 · US
Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
US-11765824-B2 · Sep 19, 2023 · US
Method and composition of scalable, infiltration free ceramic matrix composite
US-2022315493-A1 · Oct 6, 2022 · US
Beryllium oxide pedestals
US-2022289631-A1 · Sep 15, 2022 · US
Support edifice for three-dimensional printing
US-11407180-B2 · Aug 9, 2022 · US
Crucibles and compositions and processes for making same
US-2022212998-A1 · Jul 7, 2022 · US
Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
US-2022030707-A1 · Jan 27, 2022 · US
Doped beo compounds for optically stimulated luminescence (osl) and thermoluminescence (tl) radiation dosimetry
US-2021261861-A1 · Aug 26, 2021 · US
A system with a dynamic variable size nozzle orifice for three-dimensional printing
US-2021069789-A1 · Mar 11, 2021 · US
Fiber-reinforced ceramic matrix composite for electronic devices
US-10703680-B2 · Jul 7, 2020 · US
System for Drying a Paste-Based Crafting Medium During Three-Dimensional Printing
US-2019337053-A1 · Nov 7, 2019 · US
Support Edifice for Three-Dimensional Printing
US-2019337235-A1 · Nov 7, 2019 · US
Feedstock for 3d printing and uses thereof
US-2018298215-A1 · Oct 18, 2018 · US
Fiber-reinforced ceramic matrix composite for electronic devices
US-2016347674-A1 · Dec 1, 2016 · US
Methods of making a composite sheet and composite component and a composite
US-9221218-B2 · Dec 29, 2015 · US