Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor

Patent metadata

Field	Value
Publication number	US-11765824-B2
Application number	US-202117357159-A
Country	US
Kind code	B2
Filing date	Jun 24, 2021
Priority date	Jul 21, 2020
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

First claim

What is claimed is:

1. A laminated ceramic sintered body board for an electronic device, the laminated ceramic sintered body comprising:
a ceramic sintered body board; and
a flattening film provided on an upper surface of the ceramic sintered body board, the flattening film containing a thermally conductive filler,
wherein the thermally conductive filler is one or more kinds of compounds selected from the group consisting of zinc oxide (ZnO), magnesium oxide (MgO), beryllium oxide (BeO), boron nitride (BN), silicon nitride (SiNx), and diamond, and
a matrix of the flattening film includes silicon dioxide (SiO 2 ) or aluminum oxide (Al 2 O 3 ).

2. The laminated ceramic sintered body board of claim 1 ,
wherein the ceramic sintered body board is an alumina sintered body board.

3. The laminated ceramic sintered body board of claim 1 ,
wherein the thermally conductive filler is electrically insulating.

4. An electronic device comprising:
the laminated ceramic sintered body board of claim 1 .

5. A chip resistor comprising:
a laminated ceramic sintered body board for an electronic device, the laminated ceramic sintered body comprising:
a ceramic sintered body board;
a flattening film provided on an upper surface of the ceramic sintered body board, the flattening film containing a thermally conductive filler,
wherein the thermally conductive filler is one or more kinds of compounds selected from the group consisting of zinc oxide (ZnO), magnesium oxide (MgO), beryllium oxide (BeO), aluminum nitride (AlN), boron nitride (BN), silicon nitride (SiNx), and diamond, and a matrix of the flattening film includes silicon dioxide (SiO 2 ) or aluminum oxide (Al 2 O 3 );
a resistance element and a pair of upper electrodes, the resistance element and the pair of upper electrodes each being provided on a first surface of the flattening film of the laminated ceramic sintered body board, the first surface being opposite to a second surface of the flattering film, the second surface being on the ceramic sintered body board; and
a pair of end surface electrodes arranged in a lamination direction of the laminated ceramic sintered body board and the upper electrodes and being in contact with ends of the laminated ceramic sintered body board and the upper electrodes.

6. The chip resistor of claim 5 ,
wherein a thickness of the flattening film is larger than a thickness of the resistance element.

7. The chip resistor of claim 5 ,
wherein the resistance element has a meander structure.

8. The chip resistor of claim 5 ,
wherein the flattening film is in contact with at least any of the upper electrodes and the end surface electrodes.

9. A method for manufacturing the chip resistor of claim 5 , method comprising:
forming the flattening film by a sol-gel method.

10. The method of claim 9 ,
wherein, in formation of the flattening film, a thermally conductive filler having an average particle size that is smaller than or equal to an average particle size of particles for forming a matrix of the flattening film is used.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Noguchi Norimichi
• Mikami Masateru
• Toyoshima Kenji
• Oda Hiroki
• Suetsugu Daisuke
• Urakawa Tatsuya

Classifications

• H01C7/00 Primary

  Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C8/00; resistors having potential barriers, e.g. field-effect resistors, H10D1/40 - H10D1/43, H10K10/10; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H10F30/00; magnetic field controlled resistors H10N50/10; bulk negative resistance effect devices H10N80/00) · CPC title

• B32B18/00 Primary

  Layered products essentially comprising ceramics, e.g. refractory products · CPC title

• H05K1/0306 Primary

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H01C7/006

  Thin film resistors · CPC title

• H01C17/00

  Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) · CPC title