Mems pressure sensor and method of manufacturing the same
US-2015368096-A1 · Dec 24, 2015 · US
Encapsulation structure including a mechanically reinforced cap and with a getter effect
US9511991B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9511991-B2 |
| Application number | US-201414331285-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2014 |
| Priority date | Jul 26, 2013 |
| Publication date | Dec 6, 2016 |
| Grant date | Dec 6, 2016 |
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Abstract
Official abstract text for this publication.
A microdevice encapsulation structure arranged in at least one cavity formed between a substrate and a cap rigidly attached to the substrate is provided, the cap including one layer of a first material, one face of which forms an inner wall of the cavity, and mechanical reinforcement portions rigidly attached at least to and partly covering said face, having gas absorption and/or adsorption properties, in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material, wherein each of said portions includes at least one first layer of the second material, and at least one second layer of a third metallic getter material such that the first layer of the second material is arranged between the layer of the first material and the second layer of the third material and/or is covered by the second layer of the third material.
First claim
Opening claim text (preview).
The invention claimed is: 1. An encapsulation structure of at least one microdevice made on and/or in a substrate and arranged in at least one cavity formed between the substrate and a cap rigidly attached to the substrate, in which the cap includes at least: one layer of a first material, one face of which forms an inner wall of the cavity; and a plurality of mechanical reinforcement portions rigidly connected to at least said face of the layer of the first material and being a…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- B81B7/0058Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9511991B2 cover?
- A microdevice encapsulation structure arranged in at least one cavity formed between a substrate and a cap rigidly attached to the substrate is provided, the cap including one layer of a first material, one face of which forms an inner wall of the cavity, and mechanical reinforcement portions rigidly attached at least to and partly covering said face, having gas absorption and/or adsorption pro…
- Who is the assignee on this patent?
- Commissariat A L'Energie Atomique Et Aux Ene Alt, Commissariat Energie Atomique
- What technology area does this patent fall under?
- Primary CPC classification B81B7/0058. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).