Substrate conveyance robot and substrate conveyance apparatus
US-10867826-B2 · Dec 15, 2020 · US
for semiconductor wafers {Not used, see H10P72/00}(specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H10P72/00)
for semiconductor wafers {Not used, see H10P72/00}(specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H10P72/00) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B65G49/07 |
| Official title | for semiconductor wafers {Not used, see H10P72/00}(specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H10P72/00) |
| Display label | for semiconductor wafers {Not used, see H10P72/00}(specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H10P72/00) |
| Total patents | 179 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 9 |
| 2017 | 6 |
| 2018 | 11 |
| 2019 | 20 |
| 2020 | 26 |
| 2021 | 16 |
| 2022 | 17 |
| 2023 | 20 |
| 2024 | 18 |
| 2025 | 18 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Conveyance system
US-10717605-B2 · Jul 21, 2020 · US
Substrate transfer unit, and substrate processing apparatus
US-2020020560-A1 · Jan 16, 2020 · US
Substrate conveying apparatus
US-2020016777-A1 · Jan 16, 2020 · US
Wafer transfer unit and wafer transfer system
US-2019378734-A1 · Dec 12, 2019 · US
Treatment device, plating apparatus including the same, conveying device, and treatment method
US-2019376203-A1 · Dec 12, 2019 · US
Conveyance system
US-2019352099-A1 · Nov 21, 2019 · US
Substrate treating system
US-10446425-B2 · Oct 15, 2019 · US
Floating conveyor and substrate processing apparatus
US-10421622-B2 · Sep 24, 2019 · US
Substrate conveying robot and substrate processing system
US-10403530-B2 · Sep 3, 2019 · US
Substrate-processing apparatus and method of manufacturing semiconductor device
US-10403528-B2 · Sep 3, 2019 · US
Substrate gripping hand and substrate transfer device including this substrate gripping hand
US-2019263003-A1 · Aug 29, 2019 · US
Substrate transfer hand, substrate transfer robot, and substrate transfer and loading device
US-2019252227-A1 · Aug 15, 2019 · US
Adhesive structure
US-2019218426-A1 · Jul 18, 2019 · US
Teaching method of transfer device
US-2019181031-A1 · Jun 13, 2019 · US
Substrate processing device
US-2019152722-A1 · May 23, 2019 · US
Substrate transfer hand and robot
US-2019148210-A1 · May 16, 2019 · US
Substrate gripping hand and substrate transfer apparatus
US-10283395-B2 · May 7, 2019 · US
Robot Diagnosing Method
US-2019077013-A1 · Mar 14, 2019 · US
Transport fixing jig
US-2019071265-A1 · Mar 7, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B65G49/07?
- CPC B65G49/07 is the Cooperative Patent Classification code for “for semiconductor wafers {Not used, see H10P72/00}(specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H10P72/00).”
- How many patents are filed under CPC B65G49/07 (for semiconductor wafers {Not used, see H10P72/00}(specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H10P72/00))?
- Our database includes 179 publications tagged with this CPC code.
- Is patent activity under CPC B65G49/07 growing?
- Publication counts under this code: 18 in 2024 vs 18 in 2025 (latest complete years).