Use of resin-bonded materials as moulding material

Use of resin-bonded materials as moulding material · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB29K2103/00
Official titleUse of resin-bonded materials as moulding material
Display labelUse of resin-bonded materials as moulding material
Total patents46

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20155
201612
20177
20186
20195
20205
20211
20224
20241

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B29K2103/00?
CPC B29K2103/00 is the Cooperative Patent Classification code for “Use of resin-bonded materials as moulding material.”
How many patents are filed under CPC B29K2103/00 (Use of resin-bonded materials as moulding material)?
Our database includes 46 publications tagged with this CPC code.
Is patent activity under CPC B29K2103/00 growing?
Publication counts under this code: 4 in 2022 vs 1 in 2024 (latest complete years).