PatentsDB

using means to bond the moulding material to the preformed uppers

using means to bond the moulding material to the preformed uppers · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB29D35/062
Official title{using means to bond the moulding material to the preformed uppers}
Display labelusing means to bond the moulding material to the preformed uppers
Total patents41

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly growing.

Patents filed per year
YearPatents
20192
20201
202110
20222
20238
202417
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B29D35/062?
CPC B29D35/062 is the Cooperative Patent Classification code for “using means to bond the moulding material to the preformed uppers.”
How many patents are filed under CPC B29D35/062 (using means to bond the moulding material to the preformed uppers)?
Our database includes 41 publications tagged with this CPC code.
Is patent activity under CPC B29D35/062 growing?
Publication counts under this code: 8 in 2023 vs 17 in 2024 (latest complete years).