High-powered power tool system
US-12549074-B2 · Feb 10, 2026 · US
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by sawing
by sawing · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D1/02 |
| Official title | by sawing |
| Display label | by sawing |
| Total patents | 18 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 1 |
| 2019 | 1 |
| 2021 | 1 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for cutting substrate elements
US-12403627-B2 · Sep 2, 2025 · US
Glass substrate, method of manufacturing glass substrate, and method of manufacturing glass element using glass substrate
US-12319607-B2 · Jun 3, 2025 · US
Chamber bodies having machined lower walls, chamber arrangements and semiconductor processing systems having chamber bodies with machined lower walls, and methods of making chambers with machined lower walls
US-2025137722-A1 · May 1, 2025 · US
Chamber bodies having machined upper walls, chamber arrangements and semiconductor processing systems having chamber bodies with machined upper walls, and methods of making chambers with machined upper walls
US-2025137134-A1 · May 1, 2025 · US
Chamber bodies having machined walls, chamber arrangements and semiconductor processing systems having chamber bodies with machined walls, and methods of making chamber bodies
US-2025137723-A1 · May 1, 2025 · US
High-powered power tool system
US-2024258883-A1 · Aug 1, 2024 · US
High-powered power tool system
US-11936248-B2 · Mar 19, 2024 · US
Glass substrate, method of manufacturing glass substrate, and method of manufacturing glass element using glass substrate
US-2023348313-A1 · Nov 2, 2023 · US
Method for cutting substrate elements
US-2023302683-A1 · Sep 28, 2023 · US
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US-2022293450-A1 · Sep 15, 2022 · US
Methods of forming laminated glass structures
US-11318717-B2 · May 3, 2022 · US
High-powered power tool system
US-2021119514-A1 · Apr 22, 2021 · US
Methods of cutting glass laminates and glass laminates formed using such methods
US-2019315113-A1 · Oct 17, 2019 · US
Methods of forming laminated glass structures
US-2017165871-A1 · Jun 15, 2017 · US
Magnetic shape optimization
US-9312066-B2 · Apr 12, 2016 · US
Cutting method of honeycomb formed body
US-9238308-B2 · Jan 19, 2016 · US
Cutting method of honeycomb formed body
US-2015047622-A1 · Feb 19, 2015 · US