Cylindrical grinding device, cylindrical grinding method, and wafer manufacturing method
US-2026001186-A1 · Jan 1, 2026 · US
with the grinding wheel axis perpendicular to the workpiece axis · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B5/045 |
| Official title | {with the grinding wheel axis perpendicular to the workpiece axis} |
| Display label | with the grinding wheel axis perpendicular to the workpiece axis |
| Total patents | 14 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2017 | 1 |
| 2018 | 3 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 3 |
| 2025 | 1 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2026001186-A1 · Jan 1, 2026 · US
US-12304030-B2 · May 20, 2025 · US
US-11198205-B2 · Dec 14, 2021 · US
US-11117240-B2 · Sep 14, 2021 · US
US-10896822-B2 · Jan 19, 2021 · US
US-10780547-B2 · Sep 22, 2020 · US
US-10322486-B2 · Jun 18, 2019 · US
US-2019152021-A1 · May 23, 2019 · US
US-2019067018-A1 · Feb 28, 2019 · US
US-2018304440-A1 · Oct 25, 2018 · US
US-2018193978-A1 · Jul 12, 2018 · US
US-2018079047-A1 · Mar 22, 2018 · US
US-9561576-B2 · Feb 7, 2017 · US
US-9033762-B2 · May 19, 2015 · US