Cutting blade having cutting edge containing photocatalyst particles
US-2016218023-A1 · Jul 28, 2016 · US
Grinding apparatus
US10896822B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10896822-B2 |
| Application number | US-201816059661-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 9, 2018 |
| Priority date | Aug 22, 2017 |
| Publication date | Jan 19, 2021 |
| Grant date | Jan 19, 2021 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a grinding water supply unit that supplies grinding water to at least the grindstone; a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table; and a light applying unit moving section by which the light applying unit can be positioned at a first position on a rotational trajectory of the grinding wheel in the case where the grinding wheel has a first diameter and a second position on a rotational trajectory of the grinding wheel in the case where the grinding wheel has a second diameter.
First claim
Opening claim text (preview).
What is claimed is: 1. A grinding apparatus comprising: a holding table that holds a workpiece; and a grinding unit including a spindle and a grinding wheel that is mounted to the spindle and that grinds the workpiece held by the holding table, wherein the grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent, and the grinding apparatus further comprises: a grinding water supply unit that supplies grinding water to at least the grindstone when the workpiece held by the holding table is ground by the grinding unit; a light applying unit that is disposed adjacent to the holding table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the holding table; and a light applying unit moving section by which the light applying unit can be positioned at a first position on a first rotational trajectory of the grinding wheel mounted on the spindle in the case where the grinding wheel has a first diameter and a second position on a second rotational trajectory of the grinding wheel in the case where the grinding wheel has a second diameter. 2. The grinding apparatus according to claim 1 , wherein the grindstone has the abrasive grains and photocatalyst grains bound by the bonding agent, and the light applying unit applies the light that excites the photocatalyst grains. 3. The grinding apparatus according to claim 1 , wherein the bonding agent is a vitrified bond. 4. The grinding apparatus according to claim 2 , wherein the bonding agent is a vitrified bond.
Assignees
Inventors
Classifications
by grinding or lapping · CPC title
- H10P52/00Primary
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
ceramic, i.e. vitrified bondings · CPC title
involving optical means · CPC title
characterised by the composition or properties of the pad materials · CPC title
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- What does patent US10896822B2 cover?
- A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a grinding water supply unit that supplies grinding water to at least the grindstone; a light applying unit that is disp…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P52/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 19 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).