Semiconductor chip bonding apparatus including head having thermally conductive materials
US-11607741-B2 · Mar 21, 2023 · US
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using resistance wires
using resistance wires · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/053 |
| Official title | using resistance wires |
| Display label | using resistance wires |
| Total patents | 12 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2017 | 1 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 2 |
| 2022 | 2 |
| 2023 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Brazed fifth wheel hitch assembly components and method of constructing the same
US-2022055132-A1 · Feb 24, 2022 · US
Brazed fifth wheel hitch assembly components and method of constructing same
US-11229969-B2 · Jan 25, 2022 · US
Facilitating filling a plated through-hole of a circuit board with solder
US-11051407-B2 · Jun 29, 2021 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-2021069811-A1 · Mar 11, 2021 · US
Method for producing an especially large aeronautical part
US-10737343-B2 · Aug 11, 2020 · US
Apparatus and method for automated soldering process
US-2020189018-A1 · Jun 18, 2020 · US
Facilitating filling a plated through-hole of a circuit board with solder
US-2020128676-A1 · Apr 23, 2020 · US
High Power Dual Sensor Cartridge
US-2019299311-A1 · Oct 3, 2019 · US
Brazed fifth wheel hitch assembly components and method of constructing same
US-2019084065-A1 · Mar 21, 2019 · US
Method for producing an especially large aeronautical part
US-2017203378-A1 · Jul 20, 2017 · US
Integrated soldering device
US-2015271927-A1 · Sep 24, 2015 · US