Facilitating filling a plated through-hole of a circuit board with solder

Patent metadata

Field	Value
Publication number	US-11051407-B2
Application number	US-201816167705-A
Country	US
Kind code	B2
Filing date	Oct 23, 2018
Priority date	Oct 23, 2018
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

First claim

What is claimed is:

1. An apparatus to facilitate filling a plated through-hole of a circuit board with solder, the apparatus comprising:
a wire solder assembly comprising:
an insulator support;
a wire probe sized to extend from the insulator support into the plated through-hole from one side of the circuit board; and
a solder block associated with the wire probe, the wire probe passing from the insulator support through the solder block, and the solder block having a width larger than a diameter of the plated through-hole, wherein the solder block is positioned relative to the wire probe to contact a conductive pad coupled to the plated through-hole, outside the plated through-hole, when the wire probe is operatively positioned to extend into the plated through-hole from the one side of the circuit board; and

a controller to control heating of the wire probe, wherein with the wire probe inserted into the plated through-hole, the controller controls heating of the wire probe by passing a current therethrough, the heating of the wire probe heating a conductive plating of the plated through-hole and melting the solder block, the heating of the conductive plating and the melting the solder block causing solder to migrate by capillary action from outside the plated through-hole into the plated through-hole to fill the plated through-hole with the solder.

2. The apparatus of claim 1 , wherein the insulator support supports the wire probe in a looped wire configuration, and includes electrical contact pads to electrically connect a current source, controlled by the controller, to the wire probe.

3. An apparatus to facilitate filling a plated through-hole of a circuit board with solder, the apparatus comprising:
a wire solder assembly comprising:
a wire probe sized to extend into the plated through-hole from one side of the circuit board; and
a solder block associated with the wire probe, the wire probe passing through the solder block; and

a controller to control heating of the wire probe, wherein with the wire probe inserted into the plated through-hole, the controller controls heating of the wire probe by passing a current therethrough, the heating of the wire probe heating a conductive plating of the plated through-hole and melting the solder block, the heating of the conductive plating and the melting the solder block causing solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder;
wherein the wire solder assembly includes an insulator support supporting the wire probe in a looped wire configuration, and electrical contact pads to electrically connect a current source, controlled by the controller, to the wire probe; and
wherein the insulator support comprises a ceramic carrier, the ceramic carrier accommodating the solder block in a recess therein, wherein when in use, the ceramic carrier rests on the one side of the circuit board with the wire probe inserted into the plated through-hole.

4. The apparatus of claim 2 , wherein the wire probe in the looped wire configuration is of sufficient length to extend, when inserted into the plated through-hole, substantially a full length of the plated through-hole.

5. The apparatus of claim 1 , wherein the wire probe comprises a coated wire, the coated wire being an at least partially glass-insulated wire.

6. The apparatus of claim 5 , wherein the coated wire includes an uncoated portion to allow shorting out of the wire probe within the plated through-hole with solder migration into the plated through-hole reaching the uncoated portion.

7. The apparatus of claim 5 , wherein the plated through-hole is a copper-plated through-hole, and the coated wire comprises a glass-insulated nichrome wire.

8. An apparatus to facilitate filling a plated through-hole of a circuit board with solder, the apparatus comprising:
a wire solder assembly comprising:
a wire probe sized to extend into the plated through-hole from one side of the circuit board; and
a solder block associated with the wire probe, the wire probe passing through the solder block; and

a controller to control heating of the wire probe, wherein with the wire probe inserted into the plated through-hole, the controller controls heating of the wire probe by passing a current therethrough, the heating of the wire probe heating a conductive plating of the plated through-hole and melting the solder block, the heating of the conductive plating and the melting the solder block causing solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder; and
wherein:
the wire probe comprises a coated wire, the coated wire being an at least partially glass-insulated wire;
the plated through-hole is a copper-plated through-hole, and the coated wire comprises a glass-insulated nichrome wire; and
the glass-insulated nichrome wire of the wire probe is copper-coated to facilitate migration of the solder into the plated through-hole.

9. The apparatus of claim 1 , wherein the solder block is of sufficient volume to fill, when melted, the plated through-hole, with the wire probe positioned within the plated through-hole.

10. The apparatus of claim 1 , wherein the controller is configured to cease heating of the wire probe by terminating passing current through the wire probe based on determining that a resistance change in the wire probe has occurred, indicative of filling the plated through-hole with solder.

Assignees

• IBM

Inventors

• Singh Prabjit
• Kearney Daniel J

Classifications

• H05K2203/043

  Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste · CPC title

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K3/0607

  Solder feeding devices · CPC title

• H05K3/0094 Primary

  Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement · CPC title