Creation of hyperdoped semiconductors with concurrent high crystallinity and high sub-bandgap absorptance using nanosecond laser annealing
US-2017365476-A1 · Dec 21, 2017 · US
into a linear shape
into a linear shape · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/0738 |
| Official title | {into a linear shape} |
| Display label | into a linear shape |
| Total patents | 288 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 24 |
| 2017 | 32 |
| 2018 | 38 |
| 2019 | 33 |
| 2020 | 28 |
| 2021 | 35 |
| 2022 | 19 |
| 2023 | 22 |
| 2024 | 16 |
| 2025 | 23 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Annealing apparatus using two wavelengths of radiation
US-9839976-B2 · Dec 12, 2017 · US
Systems for and method of welding using beam shaping means and shielding means
US-2017334021-A1 · Nov 23, 2017 · US
Laser processing apparatus and stack processing apparatus
US-2017330973-A1 · Nov 16, 2017 · US
Systems for and method of welding with two collections of laser heat source points
US-2017304943-A1 · Oct 26, 2017 · US
Wafer processing method
US-2017301592-A1 · Oct 19, 2017 · US
Laser processing of sapphire substrate and related applications
US-2017291844-A1 · Oct 12, 2017 · US
Systems for and method of welding with a laser beam point linear profile obliquely oriented relative to the travel direction
US-2017282295-A1 · Oct 5, 2017 · US
Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocations
US-9768016-B2 · Sep 19, 2017 · US
Modular laser apparatus
US-9753290-B2 · Sep 5, 2017 · US
Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocations
US-2017250070-A1 · Aug 31, 2017 · US
Modular laser apparatus
US-9742155-B2 · Aug 22, 2017 · US
Method of laser irradiation, laser irradiation apparatus, and method of manufacturing a semiconductor device
US-2017212354-A1 · Jul 27, 2017 · US
Method and system for arresting crack propagation
US-2017189999-A1 · Jul 6, 2017 · US
Systems and methods for processing transparent materials using adjustable laser beam focal lines
US-2017189991-A1 · Jul 6, 2017 · US
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US-2017158550-A1 · Jun 8, 2017 · US
Device and method for laser processing of large-area substrates using at least two bridges
US-9656346-B2 · May 23, 2017 · US
Laser annealing apparatus and method of manufacturing display apparatus by using the same
US-2017117306-A1 · Apr 27, 2017 · US
Methods and apparatuses for fabricating glass articles
US-9617180-B2 · Apr 11, 2017 · US
Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device
US-2017062214-A1 · Mar 2, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/0738?
- CPC B23K26/0738 is the Cooperative Patent Classification code for “into a linear shape.”
- How many patents are filed under CPC B23K26/0738 (into a linear shape)?
- Our database includes 288 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/0738 growing?
- Publication counts under this code: 16 in 2024 vs 23 in 2025 (latest complete years).