Semiconductor device and manufacturing method thereof
US-2015262969-A1 · Sep 17, 2015 · US
Off substrate kinking of bond wire
US9893033B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9893033-B2 |
| Application number | US-201615096588-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2016 |
| Priority date | Nov 12, 2013 |
| Publication date | Feb 13, 2018 |
| Grant date | Feb 13, 2018 |
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- Title
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Abstract
Official abstract text for this publication.
An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of forming an electrically conductive lead of a component, comprising: using a bonding tool to bond a wire to a metal surface thereby forming a joint with the metal surface; then clamping the wire in a state of the wire extending between a surface of the bonding tool and the joint; moving the bonding tool while the wire remains clamped such that a kink forms in the wire at a position of the wire in contact with an edge of the bonding tool,…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9893033B2 cover?
- An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt prov…
- Who is the assignee on this patent?
- Invensas Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W72/015. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).