Reflow method and system
US-2025070077-A1 · Feb 27, 2025 · US
soldering by means of infrared [IR]
soldering by means of infrared [IR] · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K1/0053 |
| Official title | {soldering by means of infrared [IR]} |
| Display label | soldering by means of infrared [IR] |
| Total patents | 43 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 7 |
| 2017 | 7 |
| 2018 | 3 |
| 2019 | 7 |
| 2021 | 5 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 2 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Tabbing device for manufacturing solar cell module preventing oversoldering
US-2025031480-A1 · Jan 23, 2025 · US
Reflow method and system
US-12176319-B2 · Dec 24, 2024 · US
Soldering printed circuits using radiant heat
US-11903143-B2 · Feb 13, 2024 · US
Flip-chip bonding apparatus using VCSEL device
US-11810890-B2 · Nov 7, 2023 · US
Radiative heat collective bonder and gangbonder
US-11804467-B2 · Oct 31, 2023 · US
Soldering printed circuits using radiant heat
US-2023199971-A1 · Jun 22, 2023 · US
Reflow method and system
US-2023197671-A1 · Jun 22, 2023 · US
Reflow method and system
US-11610859-B2 · Mar 21, 2023 · US
Method and system for bonding a chip to a substrate
US-11476228-B2 · Oct 18, 2022 · US
Reflow method and system
US-2022130795-A1 · Apr 28, 2022 · US
Leadless multi-layered ceramic capacitor stack
US-11227719-B2 · Jan 18, 2022 · US
Radiative heat collective bonder and gangbonder
US-2021407958-A1 · Dec 30, 2021 · US
Bonding device
US-2021387423-A1 · Dec 16, 2021 · US
Flip-chip bonding apparatus using vcsel device
US-2021335748-A1 · Oct 28, 2021 · US
Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper
US-11153976-B2 · Oct 19, 2021 · US
Electronic component structures with reduced microphonic noise
US-10984955-B2 · Apr 20, 2021 · US
Implementing ir reflective mask to minimize cte mismatch between laminate and pth copper
US-2019364670-A1 · Nov 28, 2019 · US
Additive manufacturing method using focused light heating source
US-10471547-B2 · Nov 12, 2019 · US
Electronic Component Structures with Reduced Microphonic Noise
US-2019304698-A1 · Oct 3, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K1/0053?
- CPC B23K1/0053 is the Cooperative Patent Classification code for “soldering by means of infrared [IR].”
- How many patents are filed under CPC B23K1/0053 (soldering by means of infrared [IR])?
- Our database includes 43 publications tagged with this CPC code.
- Is patent activity under CPC B23K1/0053 growing?
- Publication counts under this code: 2 in 2024 vs 2 in 2025 (latest complete years).