Radiative heat collective bonder and gangbonder

Patent metadata

Field	Value
Publication number	US-11804467-B2
Application number	US-202016912547-A
Country	US
Kind code	B2
Filing date	Jun 25, 2020
Priority date	Jun 25, 2020
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.

First claim

I claim:

1. A semiconductor die stack bonding tool, comprising:
a bondhead coupled to a shank and configured to contact a backside of a topmost die in a die stack formed on a substrate;
a shroud positioned adjacent to the bondhead, the shroud having a sidewall with a first radiatively reflective inner surface facing the bondhead and an upper wall; and
a radiative heat source positioned above the bondhead and at a first portion of the first radiatively reflective inner surface to selectively emit a radiative heat flux in a direction away from the first portion of the first radiatively reflective inner surface toward a second portion of the first radiatively reflective inner surface such that the radiative heat flux reflects off of the second portion of the first radiatively reflective inner surface to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack.

2. The semiconductor die stack bonding tool of claim 1 , wherein the bondhead applies a conductive heat flux to the topmost die in the die stack.

3. The semiconductor die stack bonding tool of claim 1 , wherein the bondhead comprises a first bondhead and the shank comprises a first shank, and wherein the semiconductor die stack bonding tool further comprises a second bondhead coupled to a second shank and configured to contact the substrate, the second bondhead aligned vertically with the first bondhead and positioned on a side of the substrate opposite the die stack.

4. The semiconductor die stack bonding tool of claim 3 , wherein the first bondhead applies a first conductive heat flux to the topmost die in the die stack, and wherein the second bondhead applies a second conductive heat flux to the substrate toward a bottom of the die stack.

5. The semiconductor die stack bonding tool of claim 1 , wherein the upper wall has an opening through which the shank passes.

6. The semiconductor die stack bonding tool of claim 1 , wherein the upper wall has a second radiatively reflective inner surface positioned above and facing the bondhead and the radiative heat flux flows to the portion of the die stack by reflecting off of the second radiatively reflective inner surface.

7. The semiconductor die stack bonding tool of claim 1 , wherein an additional radiative heat source is positioned directly lateral to the die stack during collective bonding or gangbonding such that an additional radiative heat flux flows directly to the portion of the die stack.

8. The semiconductor die stack bonding tool of claim 5 , wherein the first shank is coupled to the upper wall such that the shroud is configured to move with the first shank.

9. A semiconductor die stack bonding tool, comprising:
a first bondhead coupled to a first shank and configured to contact a backside of a topmost die in a die stack formed on a substrate;
a second bondhead coupled to a second shank and configured to contact the substrate beneath the die stack;
a shroud positioned adjacent to the first bondhead, the shroud having a sidewall with a radiatively reflective inner surface facing the first bondhead; and
a radiative heat source positioned above the first bondhead and at a first portion of the radiatively reflective inner surface to selectively emit a radiative heat flux in a direction toward a second portion of the radiatively reflective inner surface,
wherein the first and second bondheads are configured to apply an opposing compressive pressure to the die stack, and
wherein the radiative heat source is configured to concurrently direct the radiative heat flux to the second portion of the radiatively reflective inner surface such that the radiative heat flux flows to the portion of the die stack by reflecting off of the second portion of the radiatively reflective inner surface.

10. The semiconductor die stack bonding tool of claim 9 , wherein the first bondhead applies a first conductive heat flux to the topmost die in the die stack, and wherein the second bondhead applies a second conductive heat flux to the substrate toward the die stack.

11. The semiconductor die stack bonding tool of claim 9 , wherein the shroud further comprises an upper wall having an opening through which the first shank passes during gangbonding of the die stack.

12. The semiconductor die stack bonding tool of claim 11 , wherein the radiatively reflective inner surface is a first radiatively reflective inner surface, and wherein the upper wall has a second radiatively reflective inner surface positioned above and facing the first bondhead.

13. The semiconductor die stack bonding tool of claim 12 , wherein the radiative heat flux flows to the portion of the die stack by reflecting off of the second radiatively reflective inner surface.

14. The semiconductor die stack bonding tool of claim 9 , further comprising a second radiative heat source positioned lateral to the die stack and configured to selectively emit a second radiative heat flux in a direction away from the radiatively reflective inner surface to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack.

15. The semiconductor die stack bonding tool of claim 11 , wherein the first shank is coupled to the upper wall such that the shroud is configured to move with the first shank during the gangbonding.

16. A semiconductor die stack bonding tool, comprising:
a bondhead coupled to a shank and configured to contact a backside of a topmost die in a die stack formed on a substrate;
a shroud positioned adjacent to the bondhead, the shroud having a sidewall with a first radiatively reflective inner surface facing the bondhead and an upper wall having a second radiatively reflective inner surface positioned above and facing the bondhead; and
a radiative heat source positioned in lateral alignment with or above the bondhead and at a first portion of the first radiatively reflective inner surface to selectively emit a radiative heat flux in a direction away from the first portion of the first radiatively reflective inner surface toward the second radiatively reflective inner surface such that the radiative heat flux reflects off of the second radiatively reflective inner surface and a second portion of the first radiatively reflective inner surface toward at least a portion of the die stack to reduce a vertical temperature gradient in the die stack.

17. The semiconductor die stack bonding tool of claim 16 , wherein the bondhead applies a conductive heat flux to the topmost die in the die stack.

18. The semiconductor die stack bonding tool of claim 16 , wherein the bondhead comprises a first bondhead and the shank comprises a first shank, and wherein the semiconductor die stack bonding tool further comprises a second bondhead coupled to a second shank and configured to contact the substrate, the second bondhead aligned vertically with the first bondhead and positioned on a side of the substrate opposite the die stack.

19. The semiconductor die stack bonding tool of claim 18 , wherein the first bondhead applies a first conductive heat flux to the topmost die in the die stack, and wherein the second bondhead applies a second conductive heat flux to the substrate toward a bottom of the die stack.

20. The semiconductor die stack bonding tool of claim 16 , wherein the upper wall has an opening through which the shank passes.

Assignees

• Micron Technology Inc

Inventors

• Wang Chao Wen

Classifications

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/07234

  Using a reflow oven · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/247

  Dispositions of multiple bumps · CPC title