Method for fabricating semiconductor device including a first ILD with sloped surface on a stacked structure and a second ILD on the first ILD
US-9780113-B2 · Oct 3, 2017 · US
Im Jiwoon was listed as an assignee on 1 patent publication in 2017.
| Metric | Value |
|---|---|
| Company | Im Jiwoon |
| Year | 2017 |
| Patents | 1 |
Representative publications for Im Jiwoon in 2017.
Most common classification codes for Im Jiwoon in 2017.
| CPC | Patents |
|---|---|
| H01L21/76837 | 1 |
| H01L27/1157 | 1 |
| H01L27/11575 | 1 |
| H01L27/11582 | 1 |
| H10B43/27 | 1 |
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