Compositions and Methods for the Electrodeposition of Nanotwinned Copper
US-2022298665-A1 · Sep 22, 2022 · US
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Macdermid Enthone Inc patents in 2022
Macdermid Enthone Inc was listed as an assignee on 13 patent publications in 2022.
| Metric | Value |
|---|---|
| Company | Macdermid Enthone Inc |
| Year | 2022 |
| Patents | 13 |
Patents
Representative publications for Macdermid Enthone Inc in 2022.
Cobalt filling of interconnects in microelectronics
US-11434578-B2 · Sep 6, 2022 · US
Copper electrodeposition in microelectronics
US-RE49202-E · Sep 6, 2022 · US
Method and Wet Chemical Compositions for Diffusion Barrier Formation
US-2022259724-A1 · Aug 18, 2022 · US
Cobalt filling of interconnects
US-11401618-B2 · Aug 2, 2022 · US
Top CPC classifications
Most common classification codes for Macdermid Enthone Inc in 2022.
| CPC | Patents |
|---|---|
| C25D7/123 | 6 |
| C25D3/38 | 5 |
| H10P14/47 | 5 |
| H10W20/056 | 5 |
| C25D3/16 | 4 |
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