Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
US-2017278801-A1 · Sep 28, 2017 · US
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Lei Wei-Sheng patents
Lei Wei-Sheng holds 67 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 67 |
| Recent patents | 0 |
| First publication | Jan 6, 2015 |
| Latest publication | Sep 28, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
US-2017256500-A1 · Sep 7, 2017 · US
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
US-9601375-B2 · Mar 21, 2017 · US
Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
US-2016365283-A1 · Dec 15, 2016 · US
Uv-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
US-2016315009-A1 · Oct 27, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
US-2017278801-A1 · Sep 28, 2017 · US
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
US-2017256500-A1 · Sep 7, 2017 · US
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
US-9601375-B2 · Mar 21, 2017 · US
Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
US-2016365283-A1 · Dec 15, 2016 · US
Uv-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
US-2016315009-A1 · Oct 27, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P54/00 | 62 |
| H01L21/78 | 46 |
| H10P50/242 | 45 |
| H01L21/3065 | 33 |
| H10P72/0468 | 31 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 67 |
| Operations & Transport | 34 |
| Human Necessities | 1 |
| Cross-Sectional Technologies | 1 |