Method for preparing hot-melt adhesive composition and hot-melt adhesive composition prepared thereby
US-10023769-B2 · Jul 17, 2018 · US
Okong Corp was listed as an assignee on 1 patent publication in 2018.
| Metric | Value |
|---|---|
| Company | Okong Corp |
| Year | 2018 |
| Patents | 1 |
Representative publications for Okong Corp in 2018.
Most common classification codes for Okong Corp in 2018.
| CPC | Patents |
|---|---|
| C08L21/00 | 1 |
| C08L2203/206 | 1 |
| C08L2205/025 | 1 |
| C08L2205/035 | 1 |
| C08L2312/00 | 1 |
Navigate to parent entity pages.