Electrical chemical plating process
US-9416459-B2 · Aug 16, 2016 · US
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Lin Chun-Ling patents
Lin Chun-Ling holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Apr 7, 2015 |
| Latest publication | Aug 16, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Through silicon via (TSV) structure and process thereof
US-9136170-B2 · Sep 15, 2015 · US
Semiconductor structure and fabrication method thereof
US-9000568-B2 · Apr 7, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Electrical chemical plating process
US-9416459-B2 · Aug 16, 2016 · US
Through silicon via (TSV) structure and process thereof
US-9136170-B2 · Sep 15, 2015 · US
Semiconductor structure and fabrication method thereof
US-9000568-B2 · Apr 7, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10D64/0134 | 1 |
| H10D64/017 | 1 |
| H10D64/693 | 1 |
| H10D64/691 | 1 |
| H10D64/685 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Chemistry & Metallurgy | 1 |