Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
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Lin Geraldine Tsui Yee — Electricity
Lin Geraldine Tsui Yee holds 1 patent in Electricity, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Lin Geraldine Tsui Yee |
| Technology | Electricity |
| Patents in slice | 1 |
| Recent patents in slice | 0 |
| First year | 2016 |
| Last year | 2016 |
Representative patents
Notable publications linking Lin Geraldine Tsui Yee to Electricity.
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Recent filings
Latest patents from Lin Geraldine Tsui Yee in Electricity.
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
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