Chip through flooring material using PLA resin
US-9623635-B2 · Apr 18, 2017 · US
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Kwon Jun-Hyuk patents in 2017
Kwon Jun-Hyuk was listed as an assignee on 1 patent publication in 2017.
| Metric | Value |
|---|---|
| Company | Kwon Jun-Hyuk |
| Year | 2017 |
| Patents | 1 |
Patents
Representative publications for Kwon Jun-Hyuk in 2017.
Top CPC classifications
Most common classification codes for Kwon Jun-Hyuk in 2017.
| CPC | Patents |
|---|---|
| B32B21/02 | 1 |
| B32B21/08 | 1 |
| B32B2260/026 | 1 |
| B32B2260/046 | 1 |
| B32B2307/584 | 1 |
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