Chip through flooring material using PLA resin

Patent metadata

Field	Value
Publication number	US-9623635-B2
Application number	US-201113510049-A
Country	US
Kind code	B2
Filing date	Mar 7, 2011
Priority date	Mar 15, 2010
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.

First claim

The invention claimed is:

1. A chip through flooring material using a PLA-resin, comprising:
a chip through layer comprising:
PLA chips arranged and rolled into a layer, wherein the PLA chips are formed by pulverizing a PLA-containing sheet, wherein the PLA-containing sheet comprises:
a PLA resin;
wood chips, wherein the wood chips are at least one selected from the group consisting of wood flour, chaff and bamboo chips, and are present in an amount of 200 parts by weight or less based on 100 parts by weight of the PLA resin;
a pine resin, wherein the pine resin is presented in an amount of 20 parts by weight or less and more than 0 parts by weight based on 100 parts by weight of the PLA resin; and
at least one component selected from the group consisting of 5 to 100 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer, 0.01 to 10 parts by weight of a lubricant, 0.01 to 10 parts by weight of a chain extender, and 10 parts by weight or less of an anti-hydrolysis agent based on 100 parts by weight of the PLA resin; and

at least one component selected from the group consisting of 1,000 parts by weight or less of calcium carbide (CaCO 3 ), and 50 parts by weight or less of titanium dioxide (TiO 2 ); and

a surface treatment layer on a surface of the chip through layer.

2. The chip through flooring material of claim 1 , wherein the wood chips have a particle size ranging from 10 to 120 mesh.

3. The chip through flooring material of claim 1 , wherein the chip through flooring material comprises the non-phthalate plasticizer, and the non-phthalate plasticizer is acetyl tributyl citrate (ATBC).

4. The chip through flooring material of claim 1 , wherein the chip through layer has a thickness of 1.0 to 5.0 mm.

5. The chip through flooring material of claim 1 , wherein the surface treatment layer comprises at least one of polyurethane, urethane acrylate or wax.

6. The chip through flooring material of claim 1 , wherein the surface treatment layer has a thickness of 0.01 to 0.1 mm.

7. The chip through flooring material of claim 1 , wherein the chip through flooring material comprises the chain extender, and the chain extender is at least one selected from the group consisting of a diisocyanate, an epoxy group copolymer, and a hydroxycarboxylic compound.

8. The chip through flooring material of claim 1 , wherein the chip through layer comprises the anti-hydrolysis agent, and wherein the anti-hydrolysis agent is at least one selected from the group consisting of carbodiimide and oxazoline.

9. The chip through flooring material of claim 1 , wherein the PLA-containing sheet is formed by:
mixing and kneading of the PLA resin, the wood chips, and the at least one component selected from the group consisting of the plasticizer, the acrylic copolymer, the lubricant, the chain extender and the anti-hydrolysis agent to form a mixture, and
calendaring the mixture to form the PLA sheet.

10. The chip through flooring material of claim 1 , wherein the PLA resin is an amorphous PLA resin.

11. The chip through flooring material of claim 10 , wherein the amorphous PLA resin is 100% amorphous PLA resin.

12. The chip through flooring material of claim 10 , wherein the amorphous PLA resin is a PLA resin exhibiting both crystalline and amorphous properties.

Assignees

• Huang Cheng-Zhe
• Kim Ji-Young
• Park Ki-Bong
• Kang Chang-Won
• Kwon Jun-Hyuk
• Kwon Hyun-Jong
• Park Sang-Sun
• Kim Jang-Ki
• Lee Gyeong-Min
• Lg Hausys Ltd

Inventors

• Huang Cheng-Zhe
• Kim Ji-Young
• Park Ki-Bong
• Kang Chang-Won
• Kwon Jun-Hyuk
• Kwon Hyun-Jong
• Park Sang-Sun
• Kim Jang-Ki
• Lee Gyeong-Min

Classifications

• Y10T428/3179

  Next to cellulosic · CPC title

• B32B27/308

  comprising acrylic (co)polymers · CPC title

• B32B2307/584

  Scratch resistance · CPC title

• Y10T428/31591

  Next to cellulosic · CPC title

• Y10T428/263

  Coating layer not in excess of 5 mils thick or equivalent · CPC title