Method of three dimensional integrated circuit assembly
US-9418876-B2 · Aug 16, 2016 · US
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Huang Cheng-Lin patents
Huang Cheng-Lin holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Feb 10, 2015 |
| Latest publication | Aug 16, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Solder bump for ball grid array
US-9159687-B2 · Oct 13, 2015 · US
Self-aligning conductive bump structure and method of making the same
US-9024438-B2 · May 5, 2015 · US
Surface metal wiring structure for an IC substrate
US-8953336-B2 · Feb 10, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of three dimensional integrated circuit assembly
US-9418876-B2 · Aug 16, 2016 · US
Solder bump for ball grid array
US-9159687-B2 · Oct 13, 2015 · US
Self-aligning conductive bump structure and method of making the same
US-9024438-B2 · May 5, 2015 · US
Surface metal wiring structure for an IC substrate
US-8953336-B2 · Feb 10, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/072 | 3 |
| H10W72/241 | 3 |
| H10W72/252 | 3 |
| H10W90/724 | 2 |
| H01L2224/81193 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |