Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
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Rudzki Jacek — Electricity
Rudzki Jacek holds 2 patents in Electricity, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Rudzki Jacek |
| Technology | Electricity |
| Patents in slice | 2 |
| Recent patents in slice | 0 |
| First year | 2016 |
| Last year | 2017 |
Representative patents
Notable publications linking Rudzki Jacek to Electricity.
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Recent filings
Latest patents from Rudzki Jacek in Electricity.
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
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