Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
US-11770904-B2 · Sep 26, 2023 · US
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Fukuda Metal Foil & Powder Co Ltd patents in 2023
Fukuda Metal Foil & Powder Co Ltd was listed as an assignee on 4 patent publications in 2023.
| Metric | Value |
|---|---|
| Company | Fukuda Metal Foil & Powder Co Ltd |
| Year | 2023 |
| Patents | 4 |
Patents
Representative publications for Fukuda Metal Foil & Powder Co Ltd in 2023.
Lamination shaping copper powder and laminated and shaped product
US-11752556-B2 · Sep 12, 2023 · US
Lamination shaping copper powder and laminated and shaped product
US-11667991-B2 · Jun 6, 2023 · US
Lamination shaping powder evaluation method and lamination shaping powder therefor
US-11644397-B2 · May 9, 2023 · US
Top CPC classifications
Most common classification codes for Fukuda Metal Foil & Powder Co Ltd in 2023.
| CPC | Patents |
|---|---|
| B22F10/28 | 3 |
| B22F2999/00 | 3 |
| B33Y70/00 | 3 |
| Y02P10/25 | 3 |
| B22F1/00 | 2 |
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