Through silicon via structure, method of formation, and integration in semiconductor substrate
US-9147609-B2 · Sep 29, 2015 · US
Howard David J holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Aug 4, 2015 |
| Latest publication | Sep 29, 2015 |
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2015 | 2 |
| Year | Patents |
|---|---|
| 2015 | 2 |
Latest publications where this party is an assignee.
Representative or frequently cited publications from precomputed assignee stats.
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| A61N1/37252 | 1 |
| G06Q10/10 | 1 |
| A61N1/37254 | 1 |
| H04B7/26 | 1 |
| G06F19/3418 | 1 |
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |
| Human Necessities | 1 |
| Physics | 1 |