Molded chip fabrication method and apparatus
US-10546978-B2 · Jan 28, 2020 · US
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Leung Michael S patents
Leung Michael S holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Jul 28, 2015 |
| Latest publication | Jan 28, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Molded chip fabrication method and apparatus
US-10164158-B2 · Dec 25, 2018 · US
Molded chip fabrication method and apparatus
US-9093616-B2 · Jul 28, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Molded chip fabrication method and apparatus
US-10546978-B2 · Jan 28, 2020 · US
Molded chip fabrication method and apparatus
US-10164158-B2 · Dec 25, 2018 · US
Molded chip fabrication method and apparatus
US-9093616-B2 · Jul 28, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10D62/117 | 3 |
| H10W74/00 | 3 |
| H10W74/10 | 3 |
| H10W70/60 | 3 |
| H10W74/016 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |