Thick-silver layer interface for a semiconductor die and corresponding thermal layer
US-9698116-B2 · Jul 4, 2017 · US
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Viswanathan Lakshminarayan patents
Viswanathan Lakshminarayan holds 20 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 20 |
| Recent patents | 0 |
| First publication | Apr 30, 2015 |
| Latest publication | Jul 4, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
High power semiconductor package subsystems
US-9673162-B2 · Jun 6, 2017 · US
Electronic devices with semiconductor die coupled to a thermally conductive substrate
US-9589860-B2 · Mar 7, 2017 · US
Solder wettable flanges and devices and systems incorporating solder wettable flanges
US-9538659-B2 · Jan 3, 2017 · US
Radiation devices
US-9518555-B2 · Dec 13, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Thick-silver layer interface for a semiconductor die and corresponding thermal layer
US-9698116-B2 · Jul 4, 2017 · US
High power semiconductor package subsystems
US-9673162-B2 · Jun 6, 2017 · US
Electronic devices with semiconductor die coupled to a thermally conductive substrate
US-9589860-B2 · Mar 7, 2017 · US
Solder wettable flanges and devices and systems incorporating solder wettable flanges
US-9538659-B2 · Jan 3, 2017 · US
Radiation devices
US-9518555-B2 · Dec 13, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/736 | 12 |
| H10W74/00 | 11 |
| H10W90/756 | 10 |
| H10W72/352 | 10 |
| H10W40/228 | 10 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 20 |
| Operations & Transport | 2 |
| Mechanical Engineering | 2 |
| Cross-Sectional Technologies | 1 |