Bead for 2.5D/3D chip packaging application
US-9275950-B2 · Mar 1, 2016 · US
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Kuo Feng Wei patents
Kuo Feng Wei holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Feb 10, 2015 |
| Latest publication | Mar 1, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Band pass filter for 2.5D/3D integrated circuit applications
US-9275923-B2 · Mar 1, 2016 · US
Three-dimensional integrated circuit and method for wireless information access thereof
US-9086452-B2 · Jul 21, 2015 · US
Auto frequency calibration for a phase locked loop and method of use
US-8953730-B2 · Feb 10, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Bead for 2.5D/3D chip packaging application
US-9275950-B2 · Mar 1, 2016 · US
Band pass filter for 2.5D/3D integrated circuit applications
US-9275923-B2 · Mar 1, 2016 · US
Three-dimensional integrated circuit and method for wireless information access thereof
US-9086452-B2 · Jul 21, 2015 · US
Auto frequency calibration for a phase locked loop and method of use
US-8953730-B2 · Feb 10, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/00 | 2 |
| H01L2924/15311 | 2 |
| H10W74/00 | 1 |
| H10W44/241 | 1 |
| H10W44/216 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Physics | 2 |