Semiconductor manufacturing using disposable test circuitry within scribe lanes
US-10553508-B2 · Feb 4, 2020 · US
This page is not indexed by search engines while we improve data quality.
Nguyen Phuc M patents
Nguyen Phuc M holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Sep 15, 2015 |
| Latest publication | Feb 4, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Semiconductor manufacturing for forming bond pads and seal rings
US-9601354-B2 · Mar 21, 2017 · US
Method for forming a packaged semiconductor device
US-9134366-B2 · Sep 15, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Semiconductor manufacturing using disposable test circuitry within scribe lanes
US-10553508-B2 · Feb 4, 2020 · US
Semiconductor manufacturing for forming bond pads and seal rings
US-9601354-B2 · Mar 21, 2017 · US
Method for forming a packaged semiconductor device
US-9134366-B2 · Sep 15, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Physics | 1 |