Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
US-9559088-B2 · Jan 31, 2017 · US
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Gonzalez Javier Soto patents
Gonzalez Javier Soto holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Apr 7, 2015 |
| Latest publication | Jan 31, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/732 | 2 |
| H10W90/701 | 2 |
| H10W90/22 | 2 |
| H10W74/142 | 2 |
| H10W74/019 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |